RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
N-putty5-s
9.0 W/m*K
Low outgassing
Non-silicone thermal gel differs from traditional TIMs in that it contains no silicone oil components. It effectively fills surface irregularities of electronic components while avoiding various silicone oil-related issues. Its advantages-no silicone oil contamination, no pump-out effect, excellent stability, and low thermal resistance-make it especially suitable for optical products, sensitive electronic components, and applications requiring high reliability.

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity:9.0 W/m*K
/ Bond line thickness:100-1500µm
/ Non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application

CONFIGURATIONS

/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY N-putty5-s UNIT TEST METHOD
Color Gray - Visual
Resin base Non-Silicone - -
Viscosity 25000 Pa.s DIN 53018
Flow Rate 11 g/min By LiPOLY
Density 3.3 g/cm³ ASTM D792
Application temperature -60~150 °C -
Bond line thickness 100~1500 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 9.0 W/m*K ASTM D5470
Thermal impedance@10psi / 80°C 0.036 °C-in²/ W ASTM D5470
Thermal impedance@50psi / 80°C 0.029 °C-in²/ W ASTM D5470

Related​ Product

N-putty5-s
9.0 W/m*K
Low outgassing

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    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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