RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
N-putty2-s
5.0 W/m*K
Low outgassing
Non-silicone thermal gel N-putty2-s features a thermal conductivity of 5.0 W/m*K and is free from low-molecular-weight siloxane volatiles, preventing electrical contact failures. It is ideal for optical products or sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and compensates for tolerances. It overcomes issues such as thermal grease overflow and drying. When used with LiPOLY's dedicated putty dispensing machine, it is an ideal choice for automated dispensing production.

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity:5.0 W/m*K
/ Bond line thickness:100-1000µm
/ Non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application

CONFIGURATIONS

/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY N-putty2-s UNIT TEST METHOD
Color Gray - Visual
Resin base Non-Silicone - -
Viscosity 15000 Pa.s DIN 53018
Density 3.2 g/cm³ ASTM D792
Application temperature -60~150 °C -
Bond line thickness 100~1000 μm -
Shelf life 60 months - -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 5.0 W/m*K ASTM D5470
Thermal impedance@10psi 0.045 °C-in²/ W ASTM D5470
Thermal impedance@50psi 0.036 °C-in²/ W ASTM D5470

Related​ Product

N-putty2-s
5.0 W/m*K
Low outgassing

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    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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