RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
N-putty3-s
7.0 W/m*K
Low outgassing
Silicon-Free Thermal Putty N-putty3-s with thermal conductivity of 7.0 W/m*K features no low-molecular siloxane volatilization, preventing electrical contact failures. It is ideal for optical products and sensitive electronic components. With extremely low thermal resistance and low stress, it flexibly adapts to gaps and provides tolerance compensation. It overcomes issues like thermal paste overflow and drying out, and can be paired with LiPOLY's specialized putty dispensing machine for ideal automated production.

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity:7.0 W/m*K
/ Bond line thickness:100-1500µm
/ Non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application

CONFIGURATIONS

/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY N-putty3-s UNIT TEST METHOD
Color Gray - Visual
Resin base Non-Silicone - -
Viscosity 25000 Pa.s DIN 53018
Flow Rate 13 g/min By LiPOLY
Density 3.4 g/cm³ ASTM D792
Application temperature -60~150 °C -
Bond line thickness 100~1500 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 7.0 W/m*K ASTM D5470
Thermal impedance@10psi / 80°C 0.041 °C-in²/ W ASTM D5470
Thermal impedance@50psi / 80°C 0.033 °C-in²/ W ASTM D5470

Related​ Product

N-putty3-s
7.0 W/m*K
Low outgassing

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    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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