Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
/ Thermal conductivity:7.0 W/m*K
/ Bond line thickness:100-1500µm
/ Non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application
/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg
/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle
PROPERTY | N-putty3-s | UNIT | TEST METHOD |
---|---|---|---|
Color | Gray | - | Visual |
Resin base | Non-Silicone | - | - |
Viscosity | 25000 | Pa.s | DIN 53018 |
Flow Rate | 13 | g/min | By LiPOLY |
Density | 3.4 | g/cm³ | ASTM D792 |
Application temperature | -60~150 | °C | - |
Bond line thickness | 100~1500 | μm | - |
ROHS & REACH | Compliant | - | - |
THERMAL | |||
Thermal conductivity | 7.0 | W/m*K | ASTM D5470 |
Thermal impedance@10psi / 80°C | 0.041 | °C-in²/ W | ASTM D5470 |
Thermal impedance@50psi / 80°C | 0.033 | °C-in²/ W | ASTM D5470 |