RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
N-putty-s
3.5 W/m*K
Low outgassing
Non-silicone thermal putty is a high-performance thermal interface material that does not contain silicone oil or siloxane components. If your application requires avoiding silicone oil volatilization, is sensitive to silicone ingredients, or demands long-term stability, it is recommended to choose non-silicone thermal putty. These products are especially suitable for high-end applications such as optical components, automotive electronics, and servers, and can be customized to meet specific requirements.

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity:3.5 W/m*K
/ Bond line thickness:100-1000µm
/ Non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application

CONFIGURATIONS

/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM

TYPICAL PROPERTIES

PROPERTY N-putty-s UNIT TEST METHOD
Color Gray - Visual
Resin base Non-Silicone - -
Viscosity 15000 Pa.s DIN 53018
Density 3.0 g/cm³ ASTM D792
Application temperature -60~150 °C -
Bond line thickness 100~1000 μm -
Shelf life 60 months - -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 3.5 W/m*K ASTM D5470
Thermal impedance@10psi 0.066 °C-in²/ W ASTM D5470
Thermal impedance@50psi 0.051 A °C-in²/ W ASTM D5470

Related​ Product

N-putty-s
3.5 W/m*K
Low outgassing

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    LiPOLY® Advance TIMs

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