TPS589
0.8 W/m*K
Sealing Glue
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
TPS32
1.5 W/m*K
Sealing Glue
電源保護灌封膠TPS32是一款輕量化的灌封膠。可提高PCB板或電源的性能及減少能源消耗，常被應用在航空航太及汽車電子設備上。導熱係數1.50 W/m*K，可填滿電子裝置周圍空氣空間的縫隙，固化後與發熱的電子元件和散熱器保持密切接觸，使電子產品能夠在高功率下運作進行熱傳導。能顯著提升產品的可靠度、使用壽命，並降低外界環境帶來的損害風險。
CATEGORY
Sealing Glue
FEATURES
/ Lightweight, Low Density, Thermal Conductivity 1.5 W/m*K
/ Medium-to-high hardness silicone material with excellent insulation and weather resistance
/ Suitable for automatic dispensing machine
/ TPS32 Hardened at room temperature, also can be heated to accelerate the hardening reaction.
/// It can be preserved for 60 months under the condition of unopened and under room temperature 25°C.
PRECAUTIONS
/ TPS32 If the interface has organic compounds such as Nitrogen, Phosphorous, Sulfur etc., and heavy
metals ionic compound such as Tin, Lead, Mercury, Antimony, Bismuth, Arsenic etc., and
Organometallic-salts etc., which will cause the gel incomplete curving even will be non-curved.
TYPICAL APPLICATION
/ Heat Dissipation & lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft, Sports and leisure electronic products, Portable game consoles, VR devices and etc.
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TPS32 | TEST METHOD | UNIT |
|---|---|---|---|
| Color | White(A) / Black(B) | Visual | - |
| Resin Base | Silicone | - | - |
| Viscosity | 3.2 | ISO 3219 | Pa.s |
| Density | 1.72 | ASTM D792 | g/cm³ |
| Application temperature | -60~180 | - | °C |
| Working Time | 25°C/1 hr | By LiPOLY | - |
| Hardness | 65 | ASTM D2240 | Shore A |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 1.5 | ASTM D5470 | W/m*K |
| Dielectric breakdown | 9 | ASTM D149 | KV/mm |
| Volume resistivity | >10¹³ | ASTM D257 | Ohm-m |
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