Electronic encapsulation TPS32 is a lightweight potting compound. It can improve the performance of PCB boards or power supplies and reduce energy consumption, commonly applied in aerospace and automotive electronic equipment. With a thermal conductivity of 1.50 W/m*K, it fills the gaps in the air space surrounding electronic devices, maintaining close contact with heat-generating electronic components and heat sinks after curing, allowing electronic products to operate under high power for heat conduction. It significantly enhances product reliability, service life, and reduces the risk of damage from external environments.