TPS589
0.8 W/m*K
Sealing Glue
Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
TPS31
0.55 W/m*K
Sealing Glue
TPS31 Electronic Potting Compound is a low-density electronic encapsulation material. By pouring the compound onto PCB boards and between electronic components, and allowing it to cure, it forms long-term and effective waterproofing, electrical insulation, and protection. It is used for general encapsulation, power module encapsulation, and various sensor encapsulations.
CATEGORY
Sealing Glue
FEATURES
/ Lightweight, Low Density, Thermal Conductivity 0.55 W/m*K
/ Medium-to-high hardness silicone material with excellent insulation and weather resistance
/ Suitable for automatic dispensing machine
/ TPS31 Moisture absorb hardening reaction at room temperature.
/// It can be preserved for 60 months under the condition of unopened and under room temperature 25°C.
TYPICAL APPLICATION
/ Heat Dissipation & lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft, Sports and leisure electronic products, Portable game consoles, VR devices and etc.
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TPS31 | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White(A) / Translucent(B) | - | Visual |
| Resin Base | Silicone | - | - |
| Viscosity | 1.9 | Pa.s | ISO 3219 |
| Density | 1.35 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | - |
| Working Time | 25°C/30 min | - | By LiPOLY |
| Hardness | 55 | Shore A | ASTM D2240 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 0.55 | W/m*K | ASTM D5470 |
| Dielectric breakdown | 10 | KV/mm | ASTM D149 |
| Volume resistivity | >10¹³ | Ohm-m | ASTM D257 |
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