TPS589
0.8 W/m*K
Sealing Glue
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
TPS31
0.55 W/m*K
Sealing Glue
電子灌膠TPS31是一款低密度電子灌封材料。透過將膠體澆灌於PCB板上、電子組件之間，並固化形成長期且有效的防水、電氣絕緣和保護等多重效果。用於普通灌封、電源模塊灌封、各類傳感氣灌封等。
CATEGORY
Sealing Glue
FEATURES
/ Lightweight, Low Density, Thermal Conductivity 0.55 W/m*K
/ Medium-to-high hardness silicone material with excellent insulation and weather resistance
/ Suitable for automatic dispensing machine
/ TPS31 Moisture absorb hardening reaction at room temperature.
/// It can be preserved for 60 months under the condition of unopened and under room temperature 25°C.
TYPICAL APPLICATION
/ Heat Dissipation & lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft, Sports and leisure electronic products, Portable game consoles, VR devices and etc.
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | TPS31 | TEST METHOD | UNIT |
|---|---|---|---|
| Color | White(A) / Translucent(B) | Visual | - |
| Resin Base | Silicone | - | - |
| Viscosity | 1.9 | ISO 3219 | Pa.s |
| Density | 1.35 | ASTM D792 | g/cm³ |
| Application temperature | -60~180 | - | °C |
| Working Time | 25°C/30 min | By LiPOLY | - |
| Hardness | 55 | ASTM D2240 | Shore A |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 0.55 | ASTM D5470 | W/m*K |
| Dielectric breakdown | 10 | ASTM D149 | KV/mm |
| Volume resistivity | >10¹³ | ASTM D257 | Ohm-m |
Related Product
TPS31
0.55 W/m*K
Sealing Glue
TPS5868
3.0 W/m*K
Sealing Glue
TPS586
1.5 W/m*K
Sealing Glue
TPS32
1.5 W/m*K
Sealing Glue