SH-putty3
8.0 W/m*K
No Vertical Flow
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
DTT10-s
10.0 W/m*K
No Vertical Flow
DTT10-s系列是一種低密度的凝膠填縫材料。低密度、輕量化特性，可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等，常被應用在電子產品及汽車電子設備上。產品導熱係數 10.0 W/m*K，具有高變形量，可靈活性的適配間隙，兼具公差補償特性.可克服溢流乾凅問題, 提高熱傳導，適合自動化點膠生產。
CATEGORY
Thermal Putty
FEATURES
/ Lightweight, Low Density Thermal Conductivity: 10.0 W/m*K
/ High flow rate, extrusion rate under 90psi&60s conditions:55 g/min
/ Bond line thickness:100-1500µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application
VERTICAL RELIABILITY
Using 1.5mm pad as a gap control, put the putty between the aluminum and the glass panel mark the initial position. Then, place it in the oven with 125℃ for 1,000 hours and observe its displacement after reliability test
TYPICAL APPLICATION
/ lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft, Sports and leisure electronic products, Portable computers and tablets, wearable devices, Portable game consoles, VR devices and etc.
TYPICAL PROPERTIES
| PROPERTY | DTT10-s | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Pink | Visual | - |
| Resin base | Silicone | - | - |
| Viscosity | 5000 | DIN 53018 | Pa.s |
| Flow Rate | 55 | By LiPOLY | g/min |
| Density | 2.6 | ASTM D792 | g/cm³ |
| Application temperature | -60~150 | - | °C |
| Bond line thickness | 100~1500 | - | μm |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 10.0 | ASTM D5470 | W/m*K |
| Thermal impedance@10psi / 60°C | 0.041 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50psi / 60°C | 0.035 | ASTM D5470 | °C-in²/ W |
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