RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
DTT10-s
10.0 W/m*K
No Vertical Flow
Lightweight thermal gel combines high thermal conductivity with lightweight properties. Its low-density characteristic helps reduce production costs and energy consumption while enhancing product performance. The high compressibility and tolerance compensation features allow it to fill gaps around electronic components, ensuring close contact with heat sinks and thus improving heat transfer efficiency. These advantages make it an ideal thermal management material for applications such as electronics and electric vehicles.

CATEGORY

Thermal Putty

FEATURES

/ Lightweight, Low Density Thermal Conductivity: 10.0 W/m*K
/ High flow rate, extrusion rate under 90psi&60s conditions:55 g/min
/ Bond line thickness:100-1500µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application

VERTICAL RELIABILITY

Using 1.5mm pad as a gap control, put the putty between the aluminum and the glass panel mark the initial position. Then, place it in the oven with 125℃ for 1,000 hours and observe its displacement after reliability test

TYPICAL APPLICATION

/ lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft, Sports and leisure electronic products, Portable computers and tablets, wearable devices, Portable game consoles, VR devices and etc.

TYPICAL PROPERTIES

PROPERTY DTT10-s UNIT TEST METHOD
Color Pink - Visual
Resin base Silicone - -
Viscosity 5000 Pa.s DIN 53018
Flow Rate 55 g/min By LiPOLY
Density 2.6 g/cm³ ASTM D792
Application temperature -60~150 °C -
Bond line thickness 100~1500 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 10.0 W/m*K ASTM D5470
Thermal impedance@10psi / 60°C 0.041 °C-in²/ W ASTM D5470
Thermal impedance@50psi / 60°C 0.035 °C-in²/ W ASTM D5470

Related​ Product

DTT10-s
10.0 W/m*K
No Vertical Flow

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    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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