RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation. It effectively addresses issues such as overflow and drying, improves heat transfer, and is suitable for automated dispensing production.
The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation. It effectively addresses issues such as overflow and drying, improves heat transfer, and is suitable for automated dispensing production.
The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation. It effectively addresses issues such as overflow and drying, improves heat transfer, and is suitable for automated dispensing production.
The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation. It effectively addresses issues such as overflow and drying, improves heat transfer, and is suitable for automated dispensing production.

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DTT06-s
6.0 W/m·K
No Vertical Flow
Low-density thermal gel is softer compared to traditional thermal pads, allowing it to conform closely to the surfaces of electronic components and heat sinks. This significantly increases the contact area, effectively enhancing heat dissipation efficiency and ensuring the stability and lifespan of high-performance electronic products during operation. The low-density property also helps reduce the overall weight of end products, making it especially suitable for applications with strict lightweight requirements such as mobile devices, wearable devices, and automotive electronics.
Datasheet Download

CATEGORY

Thermal Putty

FEATURES

/ Lightweight, Low Density Thermal Conductivity: 6.0 W/m*K
/ High flow rate: 59g/min @ 90psi, 60s
/ Bond line thickness：100~1500µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression andlow stress application

CONFIGURATIONS

/ Cartridges: 30ml, 150ml
/ Bucket: 1kg, 25kg

TYPICAL APPLICATION

/ lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft, Sports and leisure electronic products, Portable computers and tablets, wearable devices, Portable game consoles, VR devices and etc

TYPICAL PROPERTIES

PROPERTY DTT06-s UNIT TEST METHOD
Color Green - Visual
Resin Base Silicone - -
Viscosity 2200 Pa.s DIN 53018
Flow Rate 59 g/min By LiPOLY
Density 2.6 g/cm³ ASTM D792
Application temperature -60~150 °C -
Bond Line Thickness 100~1500 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 6.0 W/m·K ASTM D5470
Thermal impedance@10psi / 60°C 0.057 °C-in²/ W ASTM D5470
Thermal impedance@50psi / 60°C 0.048 °C-in²/ W ASTM D5470

Related Products

Thermal gel, compared to thermal grease, features non-flowing and anti-sagging properties, making it easier to clean. It can replace thermal pads and offers characteristics such as low oil bleed and non-flowing behavior. Thermal gel can fill larger gaps and simultaneously encapsulate various irregular components, maintaining stability even at high temperatures. Additionally, it provides higher dielectric breakdown voltage insulation, making it suitable for high-power electronic and electrical components.
SH-putty3
8.0 W/m·K
No Vertical Flow
S-putty5-s
10.0 W/m·K
No Vertical Flow
Thermal silicone putty is a polymer thermal interface material made with a silicone base and added thermal conductive fillers. It offers both electrical insulation and mechanical protection, efficiently transferring and dissipating heat. Thermal silicone is primarily used for thermal management and heat dissipation in industries such as electronics, electrical engineering, automotive, and lighting. Due to its high thermal conductivity, insulation, softness, and high-temperature resistance, thermal silicone has become an indispensable material for thermal management in modern electronic and electrical products.
S-putty2-s
6.0 W/m·K
No Vertical Flow
S-putty
3.5 W/m·K
No Vertical Flow
Thermal putty is primarily used to fill gaps between electronic components and heat sinks, enhancing heat dissipation efficiency. It effectively conducts heat, rapidly transferring the heat generated by components to the heat sink, thereby lowering component temperatures and preventing overheating damage. Thermal putty overcomes issues such as overflow and drying out commonly seen with thermal grease, and is an ideal choice for automated dispensing production when used with LiPOLY’s dedicated putty dispensing equipment.
H-putty2
6.0 W/m·K
No Vertical Flow

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    Thermal Solutions Expert

    LiPOLY® Advance TIMs

    Taoyuan City, Bade District, Yongfeng Road, No. 435

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