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DTT04-s 系列是一種低密度的凝膠填縫材料。低密度、輕量化特性，可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等，常被應用在電子產品及汽車電子設備上。產品導熱係數4.0 -10.0 W/m*K，具有高變形量，可靈活性的適配間隙，兼具公差補償特性.可克服溢流乾凅問題, 提高熱傳導，適合自動化點膠生產。
DTT04-s 系列是一種低密度的凝膠填縫材料。低密度、輕量化特性，可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等，常被應用在電子產品及汽車電子設備上。產品導熱係數4.0 -10.0 W/m*K，具有高變形量，可靈活性的適配間隙，兼具公差補償特性.可克服溢流乾凅問題, 提高熱傳導，適合自動化點膠生產。
DTT04-s 系列是一種低密度的凝膠填縫材料。低密度、輕量化特性，可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等，常被應用在電子產品及汽車電子設備上。產品導熱係數4.0 -10.0 W/m*K，具有高變形量，可靈活性的適配間隙，兼具公差補償特性.可克服溢流乾凅問題, 提高熱傳導，適合自動化點膠生產。
DTT04-s 系列是一種低密度的凝膠填縫材料。低密度、輕量化特性，可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等，常被應用在電子產品及汽車電子設備上。產品導熱係數4.0 -10.0 W/m*K，具有高變形量，可靈活性的適配間隙，兼具公差補償特性.可克服溢流乾凅問題, 提高熱傳導，適合自動化點膠生產。

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DTT04-s
4.0 W/m·K
No Vertical Flow
The DTT04-s is a Low-density thermal putty. Its lightweight properties reduce production costs, and minimize material usage and energy consumption. It is commonly used in electronic products and automotive electronic devices. With a thermal conductivity of 4.0 W/m*K, this product offers high deformability, allowing flexible adaptation to various gaps and providing tolerance compensation. It effectively addresses issues such as overflow and drying, improves heat transfer, and is suitable for automated dispensing production.
Datasheet Download

CATEGORY

Thermal Putty

FEATURES

/ Lightweight, Low Density Thermal Conductivity: 4.0 W/m*K
/ High flow rate: 56g/min @ 90psi, 60s
/ Bond line thickness：100~1500µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression andlow stress application

CONFIGURATIONS

/ Cartridges: 30ml, 150ml
/ Bucket: 1kg, 25kg

TYPICAL APPLICATION

/ lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft,Sports and leisure electronic products, Portable computers and tablets,wearable devices, Portable game consoles, VR devices and etc.

TYPICAL PROPERTIES

PROPERTY DTT04-s UNIT TEST METHOD
Color Yellow - Visual
Resin Base Silicone - -
Viscosity 1000 Pa.s DIN 53018
Flow Rate 56 g/min By LiPOLY
Density 2.3 g/cm³ ASTM D792
Application temperature -60~150 °C -
Bond Line Thickness 100~1500 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 4.0 W/m·K ASTM D5470
Thermal impedance@10psi / 60°C 0.084 °C-in²/ W ASTM D5470
Thermal impedance@30psi / 60°C 0.078 °C-in²/ W ASTM D5470

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SH-putty3
8.0 W/m·K
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S-putty5-s
10.0 W/m·K
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S-putty2-s
6.0 W/m·K
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S-putty
3.5 W/m·K
No Vertical Flow
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H-putty2
6.0 W/m·K
No Vertical Flow

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    Thermal Solutions Expert

    LiPOLY® Advance TIMs

    Taoyuan City, Bade District, Yongfeng Road, No. 435

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