RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Non-silicone Encapsulants

Non-silicone PCB potting compounds, such as epoxy resin and polyurethane, offer excellent durability and protection for electronic components. Epoxy resin provides high hardness, chemical resistance, and temperature stability, ideal for industrial electronics. Polyurethane offers flexibility, UV resistance, and shock absorption, suitable for consumer electronics and mobile applications.

Sealing Glue
EP770-s
2.5 W/m*K
Low outgassing
EP770-s
2.5 W/m*K
Low outgassing
EP770-s
2.5 W/m*K
Low outgassing

熱介面管理專家

LiPOLY® Advance TIMs

桃園市八德區永豐路435號

CONTACT