RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Non-silicone Thermal Adhesive

Non-silicone two-component thermal adhesive is a type of thermally conductive adhesive that effectively transfers heat from electronic components to heat sinks, ensuring devices operate within the proper temperature range. Unlike thermal paste, thermal adhesive is tacky and can bond two surfaces together while also providing thermal conductivity.

NEP230
3.0 W/m*K
Low outgassing
NEP220
2.2 W/m*K
Low outgassing
NEP230
3.0 W/m*K
Low outgassing
NEP220
2.2 W/m*K
Low outgassing
NEP230
3.0 W/m*K
Low outgassing
NEP220
2.2 W/m*K
Low outgassing

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LiPOLY® Advance TIMs

桃園市八德區永豐路435號

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