RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Lightweight Gel Pad

Low-density Thermal Pad, as next-generation lightweight heat dissipation materials, can reduce equipment weight while maintaining high thermal conductivity and enhanced structural stability, and have become key components for high-power applications such as electronic products and electric vehicles. With the rapid development of new energy industries and aerospace technology, traditional thermal interface materials can no longer meet the dual requirements of lightweight design and efficient heat dissipation.

DTT65-s
5.0 W/m*K
Absorber
Lightweight
DTT44-s
3.0 W/m*K
Absorber
Lightweight
DTT44-s
3.0 W/m*K
Absorber
Lightweight
DTT65-s
5.0 W/m*K
Absorber
Lightweight
DTT65-s
5.0 W/m*K
Absorber
Lightweight
DTT44-s
3.0 W/m*K
Absorber
Lightweight

熱介面管理專家

LiPOLY® Advance TIMs

桃園市八德區永豐路435號

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