RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Solid series

Thermal pads require no application process, avoiding potential issues such as uneven application, thickness control difficulties, and peripheral contamination that may occur when using thermal paste.

Thermal pads are pre-formed solid thermal interface materials that function by filling microscopic gaps formed due to surface roughness between heat-generating components and heat sinks, replacing air with extremely low thermal conductivity (only 0.024W/m·K), thereby significantly reducing contact thermal resistance and enhancing overall heat dissipation efficiency. Compared to traditional thermal paste, thermal pads offer distinct operational convenience advantages.

AS200-s
2.0 W/m·K
Oil bleed width < 1mm
TEM96A
2.0 W/m·K
Absorber
PK223
2.0 W/m·K
General Series
NT92-s
2.0 W/m·K
General Series
Low outgassing

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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