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Lightweight Thermal Materials for Drones

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Lightweight thermal materials for drones must satisfy high-efficiency heat dissipation requirements while maintaining lightness and environmental adaptability. From high thermal conductivity resins to aerogel insulation, innovative aerodynamic design technologies are providing diverse solutions for drone performance enhancement.

LiPOLY®

Lightweight Thermal Materials for Drones

Lightweight thermal materials for drones must satisfy high-efficiency heat dissipation requirements while maintaining lightness and environmental adaptability. From high thermal conductivity resins to aerogel insulation, innovative aerodynamic design technologies are providing diverse solutions for drone performance enhancement.
Lightweight thermal materials for drones must satisfy high-efficiency heat dissipation requirements while maintaining lightness and environmental adaptability. From high thermal conductivity resins to aerogel insulation, innovative aerodynamic design technologies are providing diverse solutions for drone performance enhancement.

Encapsulants

Low-Density Electronic Potting Compound : TPS32 Potting Compound: TPS32 features excellent thermal conductivity with ultra-low density of 1.72 g/cm³.
This potting compoundmaterial reduces damage risks from external environment factors. It is suitable for drone power module encapsulation and enables thin-profile designs.

Thermal Putty

Low-Density Thermal Putty : DTT10-s provides 10.0 W/m·K thermal conductivity with a density of only 2.6 g/cm³.
It can be applied directly to electronic components, reducing stress on components while suitable for automated production.

Lightweight thermal gel combines high thermal conductivity with lightweight properties. Its low-density characteristic helps reduce production costs and energy consumption while enhancing product performance. The high compressibility and tolerance compensation features allow it to fill gaps around electronic components, ensuring close contact with heat sinks and thus improving heat transfer efficiency. These advantages make it an ideal thermal management material for applications such as electronics and electric vehicles.

Heat Dissipation Fins and Natural Convection Design

    • Aluminum heat dissipation fins combined with vapor chamber design can effectively distribute heat generated by batteries and electronic components evenly and dissipate through natural convection. This design requires no additional power for fan operation, making it ideal for lightweight requirements.

Technological Innovation Applications

    • Aerodynamic Heat Dissipation: Some drones utilize airflow generated by propeller movement for passive cooling. DJI Mavic Mini adopts a fanless design, improving heat dissipation efficiency through redesigned airflow channels.

    • Artificial Intelligence Optimization: Using Physics-Informed Machine Learning (PIML) for fin design optimization can rapidly find optimal parameter configurations, improving heat dissipation efficiency and reducing development costs.

Future Development Directions

As drone applications diversify, lightweight thermal materials will continue developing in these directions:

  • Higher thermal conductivity and high-temperature resistance
  • Combined lightweight and environmental characteristics, using renewable or biodegradable materials
  • Automated production compatibility to reduce large-scale production costs
電源保護灌封膠 TPS32 是一款輕量化的灌封膠。可為產品提高其性能及減少能源消耗，常被應用在航空航太及汽車電子設備上。導熱係數1.50 W/m*K，，可填滿電子裝置周圍空氣空間的縫隙，固化後與發熱的電子元件和散熱器保持密切接觸，使電子產品能夠在高功率下運作進行熱傳導。能顯著提升產品的可靠度、使用壽命，並降低外界環境帶來的損害風險。
TPS32
1.5 W/m·K
Sealing Glue
電子灌膠 TPS31是一款低密度電子灌封材料。透過將膠體澆灌並固化於電子組件之間，形成長期且有效的防水、電氣絕緣和保護等多重效果。用於普通灌封、電源模塊灌封、各類傳感氣灌封等。
TPS31
0.55 W/m·K
Sealing Glue
Non-silicone lightweight thermal gel features a “non-silicone” property that prevents the silicone oil migration issues sometimes found in traditional silicone gels, effectively protecting optical or electronic components sensitive to silicone. Its “low-density” characteristic helps achieve product lightweighting and reduces stress on precision components.
NL-putty10-s
10.0 W/m·K
Low outgassing
Silicone-free lightweight thermal gel contains no silicone oil, completely eliminating the potential risk of silicone oil bleeding, thus protecting silicone-sensitive components and enhancing product reliability and environmental value. Its low-density properties significantly reduce product weight, aligning with the trend of slim and lightweight designs, lowering energy consumption, and reducing stress on small components.
NL-putty06-s
6.0 W/m·K
Low outgassing
Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.
NL-putty04-s
4.0 W/m·K
Low outgassing
Lightweight thermal putty is a low-density, lightweight thermal material commonly used in lightweight drones and EV (electric vehicle) components. For lightweight drones, reducing weight can directly extend flight endurance, as battery weight accounts for a large proportion; lowering the weight effectively improves the endurance per unit of electrical energy. In electric vehicles, lightweight design also reduces energy consumption and increases battery range.
DTT13-s
13.0 W/m·K
No Vertical Flow
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