RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
NewestDTT65-s 導熱低密度系列

NEW Product

DTT65-s 導熱低密度系列
LiPOLY DTT65-s 導熱矽膠片是一款柔軟的導熱凝膠,特別針對網路通訊應用而設計。DTT65-s 著重於介電常數(Dk)與介質損耗(Df),以降低RF模組中的干擾。其導熱係數達 5.0 W/m*K。此產品可提供標準片材、客製化裁切或客製化模塑,適用於各種廣泛的應用場合。

FEATURES

/ Lightweight, Low Density
/ Thermal conductivity: 5.0 W/m·K
/ Hardness: Shore OO/55
/ Low dielectric constant
/ For high frequency applications
/ Available in a range of thicknesses

CONFIGURATIONS

/ Sheets form
/ Die-cuts parts

Thermal Resistance vs. Pressure vs. Deflection

TYPICAL APPLICATION

/ Communications satellite
/ Satellite positioning devices
/ IoT devices
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY DTT65-s 導熱低密度系列 UNIT TEST METHOD
Color Red - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 2.1 g/cm³ ASTM D792
Hardness 55 Shore OO ASTM D2240
Water absorption 0.005 % ASTM D570
Application temperature -60~180 °C -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 5.0 W/m*K ASTM D5470
Thermal impedance@10 psi 0.350 °C-in²/ W ASTM D5470
Thermal impedance@20 psi 0.281 °C-in²/ W ASTM D5470

Contact


    Thermal Solutions Expert

    LiPOLY® Advance TIMs

    Taoyuan City, Bade District, Yongfeng Road, No. 435

    Contact