/ 6.0 W/m·K thermal conductivity for effective AI chip junction temperature reduction

/ Liquid gap-filling material that becomes heat-cured for long-term resistance to fluid flow and thermal cycling in high-load EV applications

/ Heat-cured for high structural stability under long-term fluid flow and thermal cycling

/ Compatible with immersion cooling, with no dissolution, swelling, or contaminant leaching

/ High reliability with stable thermal performance under long-term high-temperature operation