RBA
ROHS
REACH
UL
IATF 16949
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ISO/TS 16949
IECQ 080000
NewestN800C-s 非矽型導熱墊片

NEW Product

N800C-s 非矽型導熱墊片
非矽導熱化合物 N800C-s 是以非矽樹脂材料製成,不含低分子量矽氧烷揮發物,且總揮發氣體量低,不會造成電氣接觸及污染問題。N800C-s具有良好的柔韌性與優異的導熱性,低壓縮應力及高壓縮特性可有效減輕元件所受的壓力,使設備只需承受較低的機械應力,同時仍能保持低熱阻與高導熱度。

FEATURES

/ Thermal conductivity: 17.0 W/m·K
/ It’s made by non-silicone resin materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and sensitive electric components

CONFIGURATIONS

/ Sheets form
/ Die-cuts parts

Thermal Resistance vs. Pressure vs. Deflection

TYPICAL APPLICATION

/ High speed mass storage drives
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY N800C-s 非矽型導熱墊片 UNIT TEST METHOD
Color Gray - Visual
Thickness Customized mm ASTM D374
Density 3.3 g/cm³ ASTM D792
Hardness 50 Shore OO ASTM D2240
Application temperature -60~125 °C -
低分子矽氧烷 (D3 to D20 total) N.D % Gas Chromatography
Outgassing CVCM (wt%) 0.0043 - By LiPOLY
ROHS & REACH Compliant
THERMAL
Thermal conductivity 8 KV/mm ASTM D149
Thermal impedance@10 psi 0.122 °C-in²/ W ASTM D5470
Thermal impedance@30 psi 0.058 °C-in²/ W ASTM D5470

Contact


    Thermal Solutions Expert

    LiPOLY® Advance TIMs

    Taoyuan City, Bade District, Yongfeng Road, No. 435

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