FEATURES
/ Thermal conductivity: 24.0 W/m*K
/ High compression rate
/ Extremely low thermal impedance
Configurations
// Sheets form
// Die-cuts parts
Thermal Resistance vs. Pressure vs. Deflection
NEW Product
T-top99-s 超高導熱墊片
T-top99-s產品是一款極高導熱性能的高導熱墊片，導熱係數為24.0 W/m*K。具有優良的絕緣性、壓縮性，柔軟等特性，專為不平整表面需求設計，可用來填補微小間隙，表現出極低的熱阻效果，確保達到一致性的熱傳導效能。
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ High-end Chip
TYPICAL PROPERTIES
| PROPERTY | T-top99-s 超高導熱墊片 | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Gray | Visual | - |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | ASTM D374 | mm |
| Density | 3.3 | ASTM D792 | g/cm³ |
| Hardness | 70 | ASTM D2240 | Shore OOO |
| TML | <0.1 | By LiPOLY | % |
| Application temperature | -60~150 | - | °C |
| ROHS & REACH | Compliant | ||
| THERMAL | |||
| Thermal conductivity | 24.0 | ASTM D5470 | W/m*K |
| Thermal Conductivity | 15.0 | ISO 22007-2 | W/m*K |
| Thermal impedance@10psi | 0.085 | ASTM D5470 | ° C-in²/ W |
