RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
SH-putty3
8.0 W/m·K
No Vertical Flow
SH-putty3 是具有熱傳導係數:8.0W/m*K的導熱凝膠間隙填充材料,高變形量體,極低的熱阻值及低應力,可靈活性的適配間隙,兼具公差補償特性,可以克服類似導熱膏溢流、乾凅問題,可以搭配LiPOLY之putty專用智能機,自動化點膠作業生產的理想選擇。

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity: 8.0 W/m*K
/ Bond line thickness:100-3000µm
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application

CONFIGURATIONS

/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY SH-putty3 UNIT TEST METHOD
Color Gray - Visual
Resin base Silicone - -
Viscosity 17000 Pa.s DIN 53018
Flow Rate 32 g/min By LiPOLY
Density 3.4 g/cm³ ASTM D792
Application temperature -60~180 °C -
Bond line thickness 100~3000 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 8.0 W/m*K ASTM D5470
Thermal impedance@10psi / 60°C 0.039 °C-in²/ W ASTM D5470
Thermal impedance@50psi / 60°C 0.031 °C-in²/ W ASTM D5470

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