液態
墊片
吸波
膠帶
絕緣
石墨
輕量
斷熱
智能機-合體.webp)
導熱膠泥 ——
N-putty-s
3.5 W/m*K
N-putty-s 是具有熱傳導係數：3.5 W/m*K的非矽型導熱凝膠，無低分子矽氧烷揮發，不會造成電器接點故障，適合光學產品或敏感的電子原件使用，極低的熱阻值及低應力，可靈活性的適配間隙，兼具公差補償特性，可以克服類似導熱膏溢流、乾凅問題，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
CATEGORY
FEATURES
/ Thermal conductivity:3.5 W/m*K
/ Bond line thickness:100-1000µm
/ Non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application
CONFIGURATIONS
/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
TYPICAL PROPERTIES
| PROPERTY | N-putty-s | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Gray | Visual | - |
| Resin base | Non-Silicone | - | - |
| Viscosity | 15000 | DIN 53018 | Pa.s |
| Density | 3.0 | ASTM D792 | g/cm³ |
| Application temperature | -60~150 | - | °C |
| Bond line thickness | 100~1000 | - | μm |
| Shelf life | 60 months | - | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.5 | ASTM D5470 | W/m*K |
| Thermal impedance@10psi | 0.066 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50psi | 0.051 A | ASTM D5470 | °C-in²/ W |