RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
N-putty2-s
5.0 W/m*K
Low outgassing
N-putty2-s 是具有熱傳導係數:5.0W/m*K的非矽型導熱凝膠,無低分子矽氧烷揮發,不會造成電器接點故障,適合光學產品或敏感的電子原件使用,極低的熱阻值及低應力,可靈活性的適配間隙,兼具公差補償特性,可以克服類似導熱膏溢流、乾凅問題,可以搭配LiPOLY之putty專用智能機,自動化點膠作業生產的理想選擇。

CATEGORY

Thermal Putty

FEATURES

/ Thermal conductivity:5.0 W/m*K
/ Bond line thickness:100-1000µm
/ Non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application

CONFIGURATIONS

/ Cartridges: 30ml, 55ml, 330ml
/ Bucket: 1kg, 25kg

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ High speed mass storage drives
/ Telecommunication hardware
/ Flat-panel displays
/ Set-top box
/ IP CAM
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY N-putty2-s UNIT TEST METHOD
Color Gray - Visual
Resin base Non-Silicone - -
Viscosity 15000 Pa.s DIN 53018
Density 3.2 g/cm³ ASTM D792
Application temperature -60~150 °C -
Bond line thickness 100~1000 μm -
Shelf life 60 months - -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 5.0 W/m*K ASTM D5470
Thermal impedance@10psi 0.045 °C-in²/ W ASTM D5470
Thermal impedance@50psi 0.036 °C-in²/ W ASTM D5470

Related​ Product

N-putty2-s
5.0 W/m*K
Low outgassing

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