NT94-s
4.0 W/m*K
Low outgassing
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
非矽型 · 導熱材料 ——
NT92-s
2.0 W/m*K
Low outgassing
NT92-s 採用非矽型樹脂材料作成，無低分子矽氧烷揮發，是同時具有導熱及吸收電磁波功能的複合性墊片，熱傳導係數：2.0 W / m*K的間隙填充材料，應用頻率範圍10MHz-77GHz，具有柔韌性、壓縮性，可客製化裁切沖型， 旭立專業的研發能力，可即時提供尖端的發熱解決方案，以滿足客戶在面對今日先進產品上特殊的需求。
何謂低分子矽氧烷?
CATEGORY
FEATURES
/ Thermal conductivity: 2.0 W/m*K
/ Excellent absorption characteristics
/ Naturally tacky
/ Reworkable
SPECIFICATIONS
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ IC, CPU, MOS, LED, M/B, Heat sink
/ LCD-TV, Notebook PC, PC, Telecom device, Wireless hub
/ DDR II module, DVD applications, Hand-set applications
/ 5G base station & infrastructure
/ EV electric vehicle
/ 2.4 GHz Wi-Fi Router , Bluetooth
/ 3.5 GHz 5G Mobile Networks
/ 5.0 GHz Wi-Fi Router
/ 6.0 GHz Wi-Fi Router
/ 12~18 GHz Low Earth Orbit (LEO) System
/ 28 GHz 5G Mobile Networks
/ 39 GHz 5G Mobile Networks
TYPICAL PROPERTIES
| PROPERTY | NT92-s | TEST METHOD | UNIT |
|---|---|---|---|
| Color | 2.0 | Visual | - |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | ASTM D374 | mm |
| Density | 4.2 | ASTM D792 | g/cm³ |
| Hardness | 60 | ASTM D2240 | Shore OO |
| Application temperature | -60~125 | - | °C |
| Surface resistivity | >10¹⁰ | ASTM D257 | Ohm |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 2.0 | ASTM D5470 | W/m*K |
| Thermal impedance@10 psi | 1.091 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50 psi | 0.812 | ASTM D5470 | °C-in²/ W |
Related Product
NT92-s
2.0 W/m*K
Low outgassing
NT93-s
3.0 W/m*K
Low outgassing