FEATURES
/ Thermal conductivity: 1.5 W/m·K
/ Excellent absorption characteristics
/ Naturally tacky for ease of manufacture
/ Reworkable
CONFIGURATIONS
/ Sheets form
/ Die-cuts parts
Attenuation
NEW Product
Thermal Absorber Film
Multifunctional Thin Thermal EMI Absorber Film as an innovative functional composite material, offer modern electronic engineering an effective solution to tackle both heat dissipation and EMI challenges simultaneously.
TYPICAL APPLICATION
/ IC, CPU, MOS, LED, M/B, Heat sink
/ LCD-TV, Notebook PC, PC, Telecom device, Wireless hub
/ DDR II module, DVD applications, Hand-set applications
/ 5G base station & infrastructure
// 2.4 GHz Wi-Fi Router , Bluetooth
// 3.5 GHz 5G Mobile Networks
// 5.0 GHz Wi-Fi Router
// 12~18 GHz Low Earth Orbit (LEO) System
// 28 GHz 5G Mobile Networks
// 39 GHz 5G Mobile Networks
TYPICAL PROPERTIES
| PROPERTY | Thermal Absorber Film | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Dark Gray | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | 0.2 | mm | ASTM D374 |
| Density | 3.1 | g/cm³ | ASTM D792 |
| Hardness | 25 | Shore A | ASTM D2240 |
| TML | 0.04 | % | By LiPOLY |
| Water absorption | 0.04 | % | ASTM D570 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 1.5 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.324 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.288 | °C-in²/ W | ASTM D5470 |
