RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
NewestSuper Thermal Pad

NEW Product

Super Thermal Pad
T-top99-s is an ultra-high thermal conductivity gap pad with a thermal conductivity of 24.0 W/m·K. It offers excellent insulation, compressibility, and softness, designed for uneven surfaces to fill small gaps, ensuring consistent heat transfer with extremely low thermal resistance.
T-top99-s Extreme Thermal Pad is an ultra-high thermal conductivity pad with a thermal conductivity of 24.0 W/m*K. It features excellent electrical insulation, compressibility, and flexibility characteristics, specifically designed for uneven surface applications, capable of filling micro gaps and reducing contact thermal resistance.

FEATURES

/ Thermal conductivity: 24.0 W/m·K
/ High compression rate
/ Extremely low thermal impedance

CONFIGURATIONS

/ Sheets form
/ Die-cuts parts

Thermal Resistance vs. Pressure vs. Deflection

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ Flat-panel displays
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ High-end Chip

TYPICAL PROPERTIES

PROPERTY Super Thermal Pad UNIT TEST METHOD
Color Gray - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 3.3 g/cm³ ASTM D792
Hardness 70 Shore OOO ASTM D2240
TML <0.1 % By LiPOLY
Application temperature -60~150 °C -
ROHS & REACH Compliant
THERMAL
Thermal conductivity 24.0 W/m*K ASTM D5470
Thermal conductivity 15.0 W/m*K ISO 22007-2
Thermal impedance@10psi 0.085 ° C-in²/ W ASTM D5470

Contact


    Thermal Solutions Expert

    LiPOLY® Advance TIMs

    Taoyuan City, Bade District, Yongfeng Road, No. 435

    Contact