RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
NL-putty10-s
10.0 W/m*K
Low outgassing
Non-silicone lightweight thermal gel features a “non-silicone” property that prevents the silicone oil migration issues sometimes found in traditional silicone gels, effectively protecting optical or electronic components sensitive to silicone. Its “low-density” characteristic helps achieve product lightweighting and reduces stress on precision components.

CATEGORY

Thermal Putty

FEATURES

/ Lightweight, Low Density, Thermal Conductivity: 10.0 W/m*K
/ High flow rate, extrusion rate under 90psi&60s conditions: 20g/min
/ Bond line thickness:100~1500µm
/ Non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application

VERTICAL RELIABILITY

sing 1.5mm pad as a gap control, put the putty between the aluminum and the glass panel mark the initial position. Then, place it in the oven with 125℃ for 1,000 hours and observe its displacement after reliability test

TYPICAL APPLICATION

/ lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft,Sports and leisure electronic products, Portable computers and tablets,wearable devices, Portable game consoles, VR devices and etc.

TYPICAL PROPERTIES

PROPERTY NL-putty10-s UNIT TEST METHOD
Color Red - Visual
Resin base Non-Silicone - -
Viscosity 10000 Pa.s DIN 53018
Flow Rate 20 g/min By LiPOLY
Density 2.6 g/cm³ ASTM D792
Application temperature -60~125 °C -
Bond line thickness 100~1500 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 10.0 W/m*K ASTM D5470
Thermal impedance@10psi / 80°C 0.043 °C-in²/ W ASTM D5470
Thermal impedance@50psi / 80°C 0.036 °C-in²/ W ASTM D5470

Related​ Product

NL-putty10-s
10.0 W/m*K
Low outgassing

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    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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