Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
/ Lightweight, Low Density, Thermal Conductivity: 6.0 W/m*K
/ High flow rate, extrusion rate under 90psi&60s conditions: 28g/min
/ Bond line thickness:100~1500µm
/ Non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application
sing 1.5mm pad as a gap control, put the putty between the aluminum and the glass panel mark the initial position. Then, place it in the oven with 125℃ for 1,000 hours and observe its displacement after reliability test
/ lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft,Sports and leisure electronic products, Portable computers and tablets,wearable devices, Portable game consoles, VR devices and etc.
PROPERTY | NL-putty06-s | UNIT | TEST METHOD |
---|---|---|---|
Color | Purple | - | Visual |
Resin base | Non-Silicone | - | - |
Viscosity | 6000 | Pa.s | DIN 53018 |
Flow Rate | 28 | g/min | By LiPOLY |
Density | 2.6 | g/cm³ | ASTM D792 |
Application temperature | -60~125 | °C | - |
Bond line thickness | 100~1500 | μm | - |
ROHS & REACH | Compliant | - | - |
THERMAL | |||
Thermal conductivity | 6.0 | W/m*K | ASTM D5470 |
Thermal impedance@10psi / 60°C | 0.059 | °C-in²/ W | ASTM D5470 |
Thermal impedance@30psi / 60°C | 0.054 | °C-in²/ W | ASTM D5470 |