RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.
Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.
Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.
Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.

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NL-putty04-s
4.0 W/m·K
Low outgassing
Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.
Datasheet Download

CATEGORY

Thermal Putty

FEATURES

/ Lightweight, Low Density, Thermal Conductivity: 4.0 W/m*K
/ High flow rate: 29g/min @ 90psi, 60s
/ Bond line thickness：100~1500µm
/ It’s made by non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression andlow stress application

CONFIGURATIONS

/ Cartridges: 30ml, 150ml
/ Bucket: 1kg, 25kg

TYPICAL APPLICATION

/ lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft,Sports and leisure electronic products, Portable computers and tablets,wearable devices, Portable game consoles, VR devices and etc

TYPICAL PROPERTIES

PROPERTY NL-putty04-s UNIT TEST METHOD
Color Yellow - Visual
Resin Base Non-Silicone - -
Viscosity 2500 Pa.s DIN 53018
Flow Rate 29 g/min By LiPOLY
Density 2.3 g/cm³ ASTM D792
Application temperature -60~125 °C -
Bond Line Thickness 100~1500 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 4.0 W/m·K ASTM D5470
Thermal impedance@10psi / 80°C 0.088 °C-in²/ W ASTM D5470
Thermal impedance@30psi / 80°C 0.081 °C-in²/ W ASTM D5470

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Contact


    Thermal Solutions Expert

    LiPOLY® Advance TIMs

    Taoyuan City, Bade District, Yongfeng Road, No. 435

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