RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
NL-putty04-s
4.0 W/m*K
Low outgassing
Non-silicone low-density thermal putty is a specialized material designed for electronic thermal management. Unlike traditional silicone-based thermal materials, it contains no silicone oil, effectively preventing issues such as contact failure or contamination caused by silicone oil migration. This makes it especially suitable for optical or precision electronic components that are sensitive to silicone.

CATEGORY

FEATURES

/ Lightweight, Low Density, Thermal Conductivity: 4.0 W/m*K
/ High flow rate, extrusion rate under 90psi&60s conditions: 29g/min
/ Bond line thickness:100~1500µm
/ Non-silicone resin materials
/ Designed to remove manufacturing tolerances
/ Does not produce stress on delicate components
/ No vertical flow
/ Dispensable for serial manufacture
/ For any high compression and low stress application

VERTICAL RELIABILITY

sing 1.5mm pad as a gap control, put the putty between the
aluminum and the glass panel mark the initial position. Then,
place it in the oven with 125℃ for 1,000 hours and observe its
displacement after reliability test

TYPICAL APPLICATION

/ lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft,Sports and leisure electronic products, Portable computers and tablets,wearable devices, Portable game consoles, VR devices and etc.

TYPICAL PROPERTIES

PROPERTY NL-putty04-s UNIT TEST METHOD
Color Yellow - Visual
Resin base Non-Silicone - -
Viscosity 2500 Pa.s DIN 53018
Flow Rate 29 g/min By LiPOLY
Density 2.3 g/cm³ ASTM D792
Application temperature -60~125 °C -
Bond line thickness 100~1500 μm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 4.0 W/m*K ASTM D5470
Thermal impedance@10psi / 80°C 0.088 °C-in²/ W ASTM D5470
Thermal impedance@30psi / 80°C 0.081 °C-in²/ W ASTM D5470

Related​ Product

NL-putty04-s
4.0 W/m*K
Low outgassing

Contact Us


    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

    CONTACT