Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
DTT61-s
6.0 W/m·K
Single-Phase Immersion Cooling
DTT61-s is a thermal pad compatible with single-phase immersion cooling, certified by Engineered Fluids for long-term immersion environment resistance. It prevents coolant contamination and maintains high thermal conductivity characteristics while providing local isolation effects that offer an additional protective layer for electronic components, enhancing overall system stability. Customizable sizing and die-cutting are available.
CATEGORY
FEATURES
/ Thermal conductivity: 6.0 W/m·K
/ Naturally tacky for ease of manufacture
/ Low thermal impedance
/ Available in a range of thicknesses
CONFIGURATIONS
/ Roll form
/ Sheets form
/ Die-cuts parts
TYPICAL APPLICATION
/ Single-phase Immersion Cooling of Servers
/ Gaming PC
/ AI PC
/ Solid State Drive(SSD)
/ Heat pipe assemblies
/ Memory modules
/ Power amplifiers
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| PROPERTY | DTT61-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Red | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.3 | g/cm³ | ASTM D792 |
| Application temperature | -60~200 | °C | - |
| Dielectric breakdown | 8 | KV/mm | ASTM D149 |
| Surface resistivity | >10¹¹ | Ohm | ASTM D257 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 6.0 | W/m·K | ASTM D5470 |
| Thermal impedance@10 psi | 0.387 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@20 psi | 0.375 | °C-in²/ W | ASTM D5470 |
Related Products
DTT61-s
6.0 W/m·K
Single-Phase Immersion Cooling