Liquid
Solid
Absorber
Tape
Light
Insulator
Graphite
Break
AS02-s
4.5 W/m*K
Thickness 0.15 / 2.0 mm
AS02-s Ultra-thin Thermal Pad is a material with double-sided adhesive, low thermal resistance and high thermal conductivity. It features excellent compressive strength characteristics and good electrical isolation function, suitable for high-power electronic components, making it the optimal choice for thin design installations. Custom die-cutting and molding services are available.
CATEGORY
FEATURES
/ Great thermal conductivity
/ Low thermal impedance
/ High compressibility
/ Excellent elasticity
/ Suitable for high performance products
/ Die-cut part
SPECIFICATIONS
/ Roll form
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ Electronic Components – Notebookcomputers, Heat pipe assemblies, Memory modules, TV hardware, Automotive electronics, Mobile devices, HPC , servers 5G base station & infrastructure, EV electric vehicle
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| PROPERTY | AS02-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Green | - | Visual |
| Thickness | 0.15 | 0.20 mm | mm | ASTM D374 |
| Thickness | 0.0059 | 0.0079 in | inch | ASTM D374 |
| Volume resistivity | 1x10¹² | Ohm -m | ASTM D257 |
| Elongation | 10 | % | ASTM D412 |
| Weight loss | <1 | % | By LiPOLY |
| Application temperature | -50~180 | °C | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 4.5 | 4.5 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.181 | 0.266 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.128 | 0.151 | °C-in²/ W | ASTM D5470 |
Related Product
AS02-s
4.5 W/m*K
Thickness 0.15 / 2.0 mm