N800CH-s
15.0 W/m*K
Low Outgassing
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
New, 非矽型 · 導熱材料 ——
N800C-s
17.0 W/m*K
Low Outgassing
非矽導熱化合物 N800C-s 是以非矽樹脂材料製成，不含低分子量矽氧烷揮發物，且總揮發氣體量低，不會造成電氣接觸及污染問題。N800C-s具有良好的柔韌性與優異的導熱性，低壓縮應力及高壓縮特性可有效減輕元件所受的壓力，使設備只需承受較低的機械應力，同時仍能保持低熱阻與高導熱度。
CATEGORY
FEATURES
/ Thermal conductivity:17.0 W/m*K
/ It’s made by non-silicone resin materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and sensitive electric components
SPECIFICATIONS
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | N800C-s | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Gray | Visual | - |
| Thickness | Customized | ASTM D374 | mm |
| Density | 3.3 | ASTM D792 | g/cm³ |
| Hardness | 50 | ASTM D2240 | Shore OO |
| Application temperature | -60~125 | - | °C |
| Low molecular Siloxane (D3 to D20 total) | N.D | Gas Chromatography | % |
| Outgassing CVCM (wt%) | 0.0043 | By LiPOLY | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 8 | ASTM D149 | KV/mm |
| Thermal impedance@10 psi | 0.122 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@30 psi | 0.058 | ASTM D5470 | °C-in²/ W |
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