RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
N800C-s
17.0 W/m*K
Low Outgassing
Non-silicone thermal pads do not cause electrical contact or contamination issues. With the core advantage of “zero silicone contamination,” they have become an irreplaceable choice for sensitive applications in optics, medical, and semiconductor fields. As the electronics industry advances toward higher integration, higher power, and greater precision, the demand for non-silicone thermal pads will shift from being a “silicone material alternative” to an “essential solution for specific high-end applications.”

CATEGORY

FEATURES

/ Thermal conductivity:17.0 W/m*K
/ It’s made by non-silicone resin materials
/ Low contact thermal resistance
/ With electrical insulation
/ Outstanding thermal conductivity
/ Applicable to optical and sensitive electric components

SPECIFICATIONS

/ Sheet form
/ Die-cut parts

TYPICAL APPLICATION

/ HDDS
/ Optical appliance
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY N800C-s UNIT TEST METHOD
Color Gray - Visual
Thickness Customized mm ASTM D374
Density 3.3 g/cm³ ASTM D792
Hardness 50 Shore OO ASTM D2240
Application temperature -60~125 °C -
Low molecular Siloxane (D3 to D20 total) N.D % Gas Chromatography
Outgassing CVCM (wt%) 0.0043 - By LiPOLY
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 8 KV/mm ASTM D149
Thermal impedance@10 psi 0.122 °C-in²/ W ASTM D5470
Thermal impedance@30 psi 0.058 °C-in²/ W ASTM D5470

Related​ Product

N800C-s
17.0 W/m*K
Low Outgassing

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    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

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