S282-s
2.5 W/m*K
Shore OO/18
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
BS87-s
3.0 W/m*K
Shore OO/10
BS87-s是超軟又有回彈性的導熱墊片，具有極佳的應力應變性，可避免安裝應力對PCB等零部件變形，熱傳導係數：3.0W / m*K的間隙填充材料。硬度Shore OO/10 具有高柔軟性、高壓縮性、高絕緣、自黏性佳，可填補機構設計的正負公差，顯示出高穩定的特性，可客製化裁切沖型，可以滿足客戶在面對今日先進產品上特殊的需求。
CATEGORY
FEATURES
/ Thermal conductivity: 3.0 W/m*K
/ High compression rate
/ Low thermal impedance
/ High recovery
/ Available in a range of thicknesses
SPECIFICATIONS
/ Roll form
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ Notebook computers
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
Thermal Resistance vs. Pressure vs. Deflection
TYPICAL PROPERTIES
| PROPERTY | BS87-s | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Gray | Visual | - |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | ASTM D374 | mm |
| Density | 2.8 | ASTM D792 | g/cm³ |
| Hardness | 10 | ASTM D2240 | Shore OO |
| Application temperature | -60~180 | - | °C |
| Dielectric breakdown | 12 | ASTM D149 | KV/mm |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.0 | ASTM D5470 | W/m*K |
| Thermal impedance@10 psi | 0.502 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50 psi | 0.301 | ASTM D5470 | °C-in²/ W |
Related Product
BS87-s
3.0 W/m*K
Shore OO/10
BS89-s
5.0 W/m*K
Shore OO/25
BS75K-s
3.0 W/m*K
Shore OO/18