RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
BS87-s
3.0 W/m*K
Shore OO/10
BS87-s is an Exceptionally Soft Thermal Gel Pad with extremely high compliance that prevents deformation of PCB and other components during installation due to compression forces. It can fully accommodate positive and negative tolerances in mechanical design. BS87-s features a thermal conductivity of 3.0 W/m*K, Shore OO hardness of 10, offering high flexibility, high compressibility, excellent electrical insulation, and superior self-adhesive properties. Custom die-cutting and shaping services are available to meet customers' specific requirements for today's advanced products.

CATEGORY

FEATURES

/ Thermal conductivity: 3.0 W/m*K
/ High compression rate
/ Low thermal impedance
/ High recovery
/ Available in a range of thicknesses

SPECIFICATIONS

/ Roll form
/ Sheet form
/ Die-cut parts

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ Notebook computers
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle

Thermal Resistance vs. Pressure vs. Deflection

TYPICAL PROPERTIES

PROPERTY BS87-s UNIT TEST METHOD
Color Gray - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 2.8 g/cm³ ASTM D792
Hardness 10 Shore OO ASTM D2240
Application temperature -60~180 °C -
Dielectric breakdown 12 KV/mm ASTM D149
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 3.0 W/m*K ASTM D5470
Thermal impedance@10 psi 0.502 °C-in²/ W ASTM D5470
Thermal impedance@50 psi 0.301 °C-in²/ W ASTM D5470

Related​ Product

BS87-s
3.0 W/m*K
Shore OO/10

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