Exceptionally Soft Thermal Pad is a pre-formed, flexible thermal interface pad made from gel material. It combines the moldability of gel with the high thermal conductivity of silicone pads, enhancing compatibility during device assembly. This pad effectively fills irregular or large gaps, as well as products with complex structures such as protrusions or recesses. It is easy to handle, helping to reduce assembly costs and workload, and is widely used in fields such as communication equipment, computer motherboards, and memory modules.