RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
BS75K-s
3.0 W/m·K
Shore OO/18
BS75K-s is an Exceptionally Soft Thermal Pad with extremely high compliance that prevents deformation of PCB and other components during installation due to compression forces. It can fully accommodate positive and negative tolerances in mechanical design. BS75K-s features a thermal conductivity of 3.0 W/m*K, Shore OO hardness of 18, offering high flexibility, high compressibility, excellent electrical insulation, and superior self-adhesive properties.

CATEGORY

FEATURES

/ Thermal conductivity: 3.0 W/m·K
/ High compression rate
/ Extremely low thermal impedance
/ High recovery
/ Available in a range of thicknesses

CONFIGURATIONS

/ Roll form
/ Sheets form
/ Die-cuts parts

TYPICAL APPLICATION

/ Between CPU and heat sink
/ Between a component and heat sink
/ Notebook computers
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle

Thermal Resistance vs. Pressure vs. Deflection

TYPICAL PROPERTIES

PROPERTY BS75K-s UNIT TEST METHOD
Color Dark Gray - Visual
Surface tack 2-side/1-side Customized - -
Thickness Customized mm ASTM D374
Density 2.6 g/cm³ ASTM D792
Hardness 18 Shore OO ASTM D2240
Application temperature -60~180 °C -
Dielectric breakdown 12 KV/mm ASTM D149
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 3.0 W/m·K ASTM D5470
Thermal impedance@10 psi 0.562 °C-in²/ W ASTM D5470
Thermal impedance@50 psi 0.463 °C-in²/ W ASTM D5470

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