RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
TEM96D
5.0 W/m*K
Absorber
Thermally RF/EMI Absorber Pad are composite materials specifically designed to address the increasingly severe thermal management and radio frequency/electromagnetic interference compatibility challenges in modern electronic devices. TEM96D pads ingeniously combine the dual functions of high-efficiency thermal conduction and electromagnetic wave absorption, enabling rapid heat transfer from heat sources to heat sinks or external environments while reducing electromagnetic interference to ensure product quality.

CATEGORY

FEATURES

/ Thermal conductivity: 5.0 W/m*K
/ Excellent absorption characteristics
/ Naturally tacky
/ Reworkable

SPECIFICATIONS

/ Sheet form
/ Die-cut parts

TYPICAL APPLICATION

/ IC, CPU, MOS, LED, M/B, Heat sink
/ LCD-TV, Notebook PC, PC, Telecom device, Wireless hub
/ DDR II module, DVD applications, Hand-set applications
/ 5G base station & infrastructure

// 2.4 GHz Wi-Fi Router , Bluetooth
// 3.5 GHz 5G Mobile Networks
// 5.0 GHz Wi-Fi Router
// 12~18 GHz Low Earth Orbit (LEO) System
// 28 GHz 5G Mobile Networks
// 39 GHz 5G Mobile Networks

TYPICAL PROPERTIES

PROPERTY TEM96D UNIT TEST METHOD
Color Dark Gray - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 3.6 g/cm³ ASTM D792
Hardness 68 Shore OO ASTM D2240
TML 0.04 % By LiPOLY
Water absorption 0.04 % ASTM D570
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 5.0 W/m*K ASTM D5470
Thermal impedance@10 psi 0.329 °C-in²/ W ASTM D5470
Thermal impedance@50 psi 0.272 °C-in²/ W ASTM D5470

Related​ Product

TEM96D
5.0 W/m*K
Absorber

Contact Us


    熱介面管理專家

    LiPOLY® Advance TIMs

    桃園市八德區永豐路435號

    CONTACT