DTT44-s
3.0 W/m*K
5G mmWave
液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
DTT65-s
5.0 W/m*K
5G mmWave
DTT65-s是一種低密度的導熱墊片。低密度、輕量化特性，可為產品提高其性能、降低生產成本及減少材料的使用和能源消耗等，常被應用在電子產品及汽車電子設備上。產品導熱係數 5.0 W/m*K，特性專為網絡通信訊號傳輸而設計，專注於 Dk 和 Df減少射頻模塊中的干擾，硬度Shore OO 55具有柔韌性、壓縮性、絕緣性、自黏性佳，可填補機構設計的正負公差，顯示出高穩定的特性,可客製化裁切沖型。
CATEGORY
FEATURES
/ Lightweight, Low Density
/ Thermal conductivity: 5.0 W/m*K
/ Hardness: Shore OO/55
/ Low dielectric constant
/ For high frequency applications
/ Available in a range of thicknesses
SPECIFICATIONS
/ Sheet form
/ Die-cut parts
TYPICAL APPLICATION
/ Communications satellite
/ Satellite positioning devices
/ IoT devices
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | DTT65-s | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Red | Visual | - |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | ASTM D374 | mm |
| Density | 2.1 | ASTM D792 | g/cm³ |
| Hardness | 55 | ASTM D2240 | Shore OO |
| Water absorption | 0.005 | ASTM D570 | % |
| Application temperature | -60~180 | - | °C |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 5.0 | ASTM D5470 | W/m*K |
| Thermal impedance@10 psi | 0.350 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@20 psi | 0.342 | ASTM D5470 | °C-in²/ W |
Related Product
DTT65-s
5.0 W/m*K
5G mmWave