RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Lightweight Potting

Low-density electronic potting compounds enhance durability, moisture resistance, and thermal conductivity while maintaining excellent electrical insulation. They protect critical components, extend service life, and improve product competitiveness across diverse applications.

Sealing Glue
TPS32
1.5 W/m*K
Sealing Glue
TPS31
0.55 W/m*K
Sealing Glue
TPS31
0.55 W/m*K
Sealing Glue
TPS32
1.5 W/m*K
Sealing Glue
TPS32
1.5 W/m*K
Sealing Glue
TPS31
0.55 W/m*K
Sealing Glue

熱介面管理專家

LiPOLY® Advance TIMs

桃園市八德區永豐路435號

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