RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Lightweight Putty

Low-density thermal putty typically features lightweight properties, low thermal resistance, excellent plasticity, and is suitable for dispensing operations. It can be used to fill gaps between electronic components and heat sinks to improve thermal conductivity. Its low-density characteristic makes it easy to apply on irregular surfaces and effectively reduces thermal resistance. The application range is extensive, including electronic components, electric vehicles, 5G communication equipment, servers, integrated circuits, and more.

Thermal Putty
DTT13-s
13.0 W/m*K
No Vertical Flow
DTT10-s
10.0 W/m*K
No Vertical Flow
DTT06-s
6.0 W/m*K
No Vertical Flow
DTT04-s
4.0 W/m*K
No Vertical Flow
DTT04-s
4.0 W/m*K
No Vertical Flow
DTT06-s
6.0 W/m*K
No Vertical Flow
DTT10-s
10.0 W/m*K
No Vertical Flow
DTT13-s
13.0 W/m*K
No Vertical Flow
DTT13-s
13.0 W/m*K
No Vertical Flow
DTT10-s
10.0 W/m*K
No Vertical Flow
DTT06-s
6.0 W/m*K
No Vertical Flow
DTT04-s
4.0 W/m*K
No Vertical Flow

熱介面管理專家

LiPOLY® Advance TIMs

桃園市八德區永豐路435號

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