RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Lightweight Putty

Thermal Putty is a specialized material designed to improve heat conduction efficiency, primarily used to fill microscopic gaps between electronic components and heat sinks, significantly enhancing thermal performance by increasing contact area. It is widely applied in consumer electronics, LED lighting, communication equipment, and automotive electronics. Compared to thermal paste, thermal gel offers better reworkability and longer service life. Compared to thermal pads, thermal gel can better fill irregular-shaped gaps and provide lower contact thermal resistance. Compared to thermal tape, thermal gel has higher thermal conductivity and superior gap-filling capability.

Thermal Gel
DTT13-s
13.0 W/m·K
No Vertical Flow
DTT10-s
10.0 W/m·K
No Vertical Flow
DTT06-s
6.0 W/m·K
No Vertical Flow
DTT04-s
4.0 W/m·K
No Vertical Flow
DTT04-s
4.0 W/m·K
No Vertical Flow
DTT06-s
6.0 W/m·K
No Vertical Flow
DTT10-s
10.0 W/m·K
No Vertical Flow
DTT13-s
13.0 W/m·K
No Vertical Flow
DTT13-s
13.0 W/m·K
No Vertical Flow
DTT10-s
10.0 W/m·K
No Vertical Flow
DTT06-s
6.0 W/m·K
No Vertical Flow
DTT04-s
4.0 W/m·K
No Vertical Flow

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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