RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

Lightweight Thermal Putty

The non-silicone lightweight thermal putty does not generate low-molecular-weight siloxane volatiles, preventing electrical contact failures. In addition, it features high deformability, allowing flexible gap filling and tolerance compensation, overcoming issues such as overflow and drying, and is suitable for automated dispensing production. The thermal conductivity typically ranges from 4.0 to 10.0 W/m*K.

Thermal Putty
NL-putty10-s
10.0 W/m*K
Low outgassing
NL-putty06-s
6.0 W/m*K
Low outgassing
NL-putty04-s
4.0 W/m*K
Low outgassing
NL-putty10-s
10.0 W/m*K
Low outgassing
NL-putty06-s
6.0 W/m*K
Low outgassing
NL-putty04-s
4.0 W/m*K
Low outgassing
NL-putty10-s
10.0 W/m*K
Low outgassing
NL-putty06-s
6.0 W/m*K
Low outgassing
NL-putty04-s
4.0 W/m*K
Low outgassing

熱介面管理專家

LiPOLY® Advance TIMs

桃園市八德區永豐路435號

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