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REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000

非矽型 · 輕量化導熱系列

Silicone Free lightweight thermal interface materials are rapidly transforming the development trajectory of thermal management technology in electronic products. Not only address concerns about silicone contamination in sensitive electronic devices but also achieve significant weight reduction through innovative material design while maintaining or enhancing thermal conductivity performance.

NL-putty04-s
4.0 W/m·K
Low outgassing
NL-putty06-s
6.0 W/m·K
Low outgassing
NL-putty10-s
10.0 W/m·K
Low outgassing
NL-putty10-s
10.0 W/m·K
Low outgassing
NL-putty06-s
6.0 W/m·K
Low outgassing
NL-putty04-s
4.0 W/m·K
Low outgassing
NL-putty10-s
10.0 W/m·K
Low outgassing
NL-putty06-s
6.0 W/m·K
Low outgassing
NL-putty04-s
4.0 W/m·K
Low outgassing

Thermal Solutions Expert

LiPOLY® Advance TIMs

Taoyuan City, Bade District, Yongfeng Road, No. 435

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