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IATF 16949
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ISO 9001
ISO/TS 16949
IECQ 080000

Ultra Thin Film

Ultra-Thin Thermal Films are materials used to improve heat dissipation in electronic components. They feature high thermal conductivity, low thermal resistance, and excellent electrical insulation properties. The ultra-thin design makes them suitable for space-constrained applications or products requiring high-precision assembly, such as servers, storage devices, and optical instruments. Ultra-thin thermal pads ensure tight contact between components, thereby minimizing thermal resistance to the maximum extent.

AS02-s
4.5 W/m*K
Thickness 0.15 / 2.0 mm
AS02-s
4.5 W/m*K
Thickness 0.15 / 2.0 mm
AS02-s
4.5 W/m*K
Thickness 0.15 / 2.0 mm

熱介面管理專家

LiPOLY® Advance TIMs

桃園市八德區永豐路435號

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