RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
NewestLightweight Thermal Pad

NEW Product

Lightweight Thermal Pad
DTT65-s is a soft thermal gel pad for network communication, designed to minimize RF module interference by focusing on low dielectric constant (Dk) and loss (Df). It has a 5.0 W/m·K thermal conductivity and is available in custom sheets, die-cuts, or molded parts.

FEATURES

/ Lightweight, Low Density
/ Thermal conductivity: 5.0 W/m·K
/ Hardness: Shore OO/55
/ Low dielectric constant
/ For high frequency applications
/ Available in a range of thicknesses

CONFIGURATIONS

/ Sheets form
/ Die-cuts parts

Thermal Resistance vs. Pressure vs. Deflection

TYPICAL APPLICATION

/ Communications satellite
/ Satellite positioning devices
/ IoT devices
/ Telecommunication hardware
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY Lightweight Thermal Pad UNIT TEST METHOD
Color Red - Visual
Surface tack 2-side/1-side 2 - -
Thickness Customized mm ASTM D374
Density 2.1 g/cm³ ASTM D792
Hardness 55 Shore OO ASTM D2240
Water absorption 0.005 % ASTM D570
Application temperature -60~180 °C -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 5.0 W/m*K ASTM D5470
Thermal impedance@10 psi 0.350 °C-in²/ W ASTM D5470
Thermal impedance@20 psi 0.281 °C-in²/ W ASTM D5470

Contact


    Thermal Solutions Expert

    LiPOLY® Advance TIMs

    Taoyuan City, Bade District, Yongfeng Road, No. 435

    Contact