FEATURES
/ Thermal conductivity: 5.0 W/m·K
/ Excellent absorption characteristics
/ Naturally tacky for ease of manufacture
/ Reworkable
CONFIGURATIONS
/ Sheets form
/ Die-cuts parts
Attenuation
NEW Product
EMI Shielding Pad
TEM96D is a composite pad that features both thermal conductivity and electromagnetic wave absorption capabilities. As a gap-filling material with a thermal conductivity of 5.0 W/m·K, it can absorb electromagnetic radiation to mitigate EMI issues.
TYPICAL APPLICATION
/ IC, CPU, MOS, LED, M/B, Heat sink
/ LCD-TV, Notebook PC, PC, Telecom device, Wireless hub
/ DDR II module, DVD applications, Hand-set applications
/ 5G base station & infrastructure
// 2.4 GHz Wi-Fi Router , Bluetooth
// 3.5 GHz 5G Mobile Networks
// 5.0 GHz Wi-Fi Router
// 12~18 GHz Low Earth Orbit (LEO) System
// 28 GHz 5G Mobile Networks
// 39 GHz 5G Mobile Networks
TYPICAL PROPERTIES
| PROPERTY | EMI Shielding Pad | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Dark Gray | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.6 | g/cm³ | ASTM D792 |
| Hardness | 68 | Shore OO | ASTM D2240 |
| TML | 0.04 | % | By LiPOLY |
| Water absorption | 0.04 | % | ASTM D570 |
| ROHS & REACH | Compliant | -60~180°C | Application temperature |
| THERMAL | |||
| Thermal conductivity | 5.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.329 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50 psi | 0.272 | ° C-in²/ W | ASTM D5470 |
