DTT54-s features a thermal conductivity of 4.0 W/m·K and provides a structurally stable, high-performance thermal interface layer. It is designed for use between chips and cold plates or other heat dissipation structures, forming a low thermal interface resistance and a long-term reliable heat transfer path to effectively reduce junction temperatures. Even under prolonged immersion in cooling fluids, the material resists loss, displacement, and performance degradation, ensuring stable and reliable thermal performance during long-term operation.