NEW
DTT54-s Thermal Conductive Die Attach Adhesive
Thermal conductivity：
4.0 W/m·K
DTT54-s features a thermal conductivity of 4.0 W/m·K and provides a structurally stable, high-performance thermal interface layer. It is designed for use between chips and cold plates or other heat dissipation structures, forming a low thermal interface resistance and a long-term reliable heat transfer path to effectively reduce junction temperatures.
Even under prolonged immersion in cooling fluids, the material resists loss, displacement, and performance degradation, ensuring stable and reliable thermal performance during long-term operation.
FEATURES
- / 6.0 W/m·K thermal conductivity for effective AI chip junction temperature reduction
- Liquid gap-filling material that becomes heat-cured for long-term resistance to fluid flow and thermal cycling in high-load EV applications
- Heat-cured for high structural stability under long-term fluid flow and thermal cycling
- Compatible with immersion cooling, with no dissolution, swelling, or contaminant leaching
- High reliability with stable thermal performance under long-term high-temperature operation
CONFIGURATIONS
- Cartridges: 50ml, 400ml
- Other special and custom sizes are available upon request
TYPICAL APPLICATION
- AI GPU Modules (NVIDIA, AMD, and proprietary ASICs)
- AI Servers with Immersion Cooling
- High-Power Accelerator Cards, including OAM, HGX, and custom-designed modules
- Liquid Cooling / Immersion Hybrid Thermal Architecture
- High-Performance Computing (HPC) Systems
- Industrial Servers / Industrial Control Computing Platforms
- Power Modules / Power Electronics Cooling
- Telecommunications / 5G High-Density Computing Modules
- EV / New Energy High-Power Electronic Modules
Specifications
| Property | DTT54-s Thermal Conductive Die Attach Adhesive | UNIT | TEST METHOD |
|---|---|---|---|
| Color | White (A part) Gray (B part) | – | Visual |
| A:B | 100:100 | – | – |
| Viscosity A | 139 | Pa.s | ISO 3219 |
| Viscosity B | 139 | Pa.s | ISO 3219 |
| Density | 2.7 | g/cm³ | ASTM D792 |
| Shelf Life | 24 months | – | – |
| Hardness after curing | 40 | Shore A | ASTM D2240 |
| ROHS & REACH | Compliant | – | – |
| THERMAL | |||
| Thermal conductivity | 4.0 | W/m·K | ASTM D5470 |
| Thermal impedance@2mils BLT | – | °C-in²/ W | ASTM D5470 |
| Working temp (long term) | -60 ~ 200 | °C | – |