NEW Product
/ Thermal conductivity: 6.0 W/m·K
/ Naturally tacky for ease of manufacture
/ Low thermal impedance
/ Available in a range of thicknesses
/ Roll form
/ Sheets form
/ Die-cuts parts
/ Single-phase Immersion Cooling of Servers
/ Gaming PC
/ AI PC
/ Solid State Drive(SSD)
/ Heat pipe assemblies
/ Memory modules
/ Power amplifiers
| PROPERTY | Single-Phase Immersion Thermal Pad DTT61-s | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Red | - | Visual |
| Surface tack 2-side/1-side | 2 | - | - |
| Thickness | Customized | mm | ASTM D374 |
| Density | 3.3 | g/cm³ | ASTM D792 |
| Application temperature | -60~200 | °C | - |
| Dielectric breakdown | 8 | KV/mm | ASTM D149 |
| Surface resistivity | >10¹¹ | Ohm | ASTM D257 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 6.0 | W/m*K | ASTM D5470 |
| Thermal impedance@10 psi | 0.387 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@20 psi | 0.375 | °C-in²/ W | ASTM D5470 |
