液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
PK404DM
3.6 W/m·K
Fast Curing in room temperature
散熱填縫膠主要用於填補電子元件與散熱器之間的縫隙，以提高散熱效率。它能有效地傳導熱量，並防止空氣進入，減少熱阻抗。PK404DM可以在室溫或高溫下固化，與導熱墊片相比，導熱填縫膠不僅對部件產生低應力、高導熱性、低粘度，同時能保持絕緣性能，可以搭配LiPOLY之putty專用智能機，自動化點膠作業生產的理想選擇。
CATEGORY
Dispensing Robot
FEATURES
/ Thermal conductivity: 3.6 W/m*K
/ Fast curing in normal atmospheric temperature
/ Great reliability
/ Great sealing in low pressure
CONFIGURATIONS
/ Cartridges: 50ml, 400ml
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ Between CPU and heat sink
/ Between a component and heat sink
/ Power supplies
/ High speed mass storage drives
/ Telecommunication hardware
/ Electric vehicle& Automotive battery
/ 5G base station & infrastructure
/ EV electric vehicle
TYPICAL PROPERTIES
| PROPERTY | PK404DM | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Blue-A White-B | - | Visual |
| Solid content | Two-part : 100:100 | - | - |
| Viscosity A | 47 | Pa.s | ISO 3219 |
| Viscosity B | 48 | Pa.s | ISO 3219 |
| Density | 3.0 | g/cm³ | ASTM D792 |
| Shelf life | 24 months | - | - |
| Hardness (AFTER CURE) | 80 | Shore OO | ASTM D2240 |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 3.6 | W/m*K | ASTM D5470 |
| Thermal impedance@10mils BLT | 0.252 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@20mils BLT | 0.471 | °C-in²/ W | ASTM D5470 |
Related Product
PK700DM
7.0 W/m·K
Fast Curing in room temperature
PK605DM
5.0 W/m·K
Fast Curing in room temperature
PK223DM
2.2 W/m·K
Fast Curing in room temperature