RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
TIM14
4.0 W/m·K
No freeze preservation required
TIM1 導熱固晶膠主要應用於積體電路封裝,用於芯片與均熱片之間的連接,以提高散熱效率,確保電子元件的穩定運行。 它適合自動化點膠作業生產。TIM14 是可以在高溫下固化的雙劑型導熱接著固晶膠不僅對部件產生低應力、低熱阻、良好的黏著力,同時能保持絕緣性能,適合自動化點膠作業生產 。

CATEGORY

Thermal Putty

FEATURES

/ Excellent thermal conductivity 4.0 W/m*K
/ No freeze preservation required
/ Dispensable for serial manufacture
/ Adhesive for IC packaging design

CONFIGURATIONS

/ Cartridges: 50ml

TYPICAL APPLICATION

/ Designed to provide efficient thermal transfer for the cooling of chip packaging as TIM-1.
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY TIM14 UNIT TEST METHOD
Color Gray-A White-B - Visual
Resin base Silicone - -
Form Grease - Visual
Viscosity A/B 380 Pa.s ISO 3219
Working time 25°C / 24hr - By LiPOLY
BLT 27 µm -
Elongation 110 % ASTM D412
Adhesive strength 3.5 kgf/cm² -
THERMAL
Thermal conductivity 4.0 W/m*K ASTM D5470
Dielectric breakdown 25 KV/mm ASTM D149
Surface resistivity >10¹³ Ohm ASTM D257

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