RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
TIM12
2.0 W/m·K
No freeze preservation required
TIM1 導熱晶片接著劑是一種熱固型導熱膏,用於積體電路封裝中芯片和均熱片之間的熱傳導。它是一種膏狀材料,在高溫下固化,具有低熱阻和良好的黏著力,能有效填充介面空隙,提升熱傳導效率。 TIM12 是可以在高溫下固化的雙劑型導熱接著固晶膠不僅對部件產生低應力、低熱阻、良好的黏著力,同時能保持絕緣性能,熱傳導係數2.0 W/m*K的TIM 1間隙導熱填充材料,適合自動化點膠作業生產 。

CATEGORY

Thermal Putty

FEATURES

/ Excellent thermal conductivity 2.0 W/m*K
/ No freeze preservation required.
/ Dispensable for serial manufacture
/ Adhesive for IC packaging design

CONFIGURATIONS

/ Cartridges: 50ml

TYPICAL APPLICATION

/ Designed to provide efficient thermal transfer for the cooling of chip packaging as TIM-1.
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY TIM12 UNIT TEST METHOD
Color Gray-A White-B - Visual
Resin base Silicone - -
Form Grease - Visual
Viscosity A/B 190/150 Pa.s ISO 3219
Working time 25°C / 24hr - By LiPOLY
BLT 27 µm -
Elongation 170 % ASTM D412
Adhesive strength 0.64 - -
THERMAL
Thermal conductivity 2.0 W/m*K ASTM D5470
Dielectric breakdown 25 KV/mm ASTM D149
Surface resistivity >10¹³ Ohm ASTM D257

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