液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
/ Thermal conductivity: 6.0 W/m*K
/ Low thermal impedance
/ Can be applied manually dispensed or screen printed
/ Low minimum bond line
/ Tinplate Can: 1kg
/ Other special and custom sizes are available upon request
/ LED appliance
/ EV electric vehicle
/ CPU and chip coolers
/ Switching power supplies
/ 5G base station & infrastructure
/ Between any heat-generating component and heat sink
| PROPERTY | G3380T | TEST METHOD | UNIT |
|---|---|---|---|
| Color | Gray | Visual | - |
| Resin base | Silicone | - | - |
| Filler | Non-Metal | - | - |
| Viscosity | 181 | ISO 3219 | Pa.s |
| Density | 2.7 | ASTM D792 | g/cm³ |
| Application temperature | -60~180 | - | °C |
| Bond line thickness | 30 | - | µm |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 6.0 | ASTM D5470 | W/m*K |
| Thermal impedance@50psi | 0.01 | ASTM D5470 | °C-in²/ W |
| Thermal impedance@50psi | 6.4 | ASTM D5470 | °C-mm²/ W |
