液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
G3380T
6.0 W/m·K
Low minimum bond line
將散熱膏塗抹在CPU表面後，就能有效排除處理器與散熱器之間多餘的空氣，發揮高效能的導熱效果，讓CPU產生的熱能更快速地傳遞到散熱器，進而提升電腦整體散熱表現。G3380T 系列導熱膏具有極低熱阻和良好的導熱性，已廣泛用於消費電子產品和微處理器的熱控制技術，當組件的溫度升高，潤滑脂的黏性會降低，可以潤濕界面元件，熱傳導係數：6.0 W/m*K的間隙填充材料。
CATEGORY
FEATURES
/ Thermal conductivity: 6.0 W/m*K
/ Low thermal impedance
/ Can be applied manually dispensed or screen printed
/ Low minimum bond line
CONFIGURATIONS
/ Tinplate Can: 1kg
/ Other special and custom sizes are available upon request
TYPICAL APPLICATION
/ LED appliance
/ EV electric vehicle
/ CPU and chip coolers
/ Switching power supplies
/ 5G base station & infrastructure
/ Between any heat-generating component and heat sink
TYPICAL PROPERTIES
| PROPERTY | G3380T | UNIT | TEST METHOD |
|---|---|---|---|
| Color | Gray | - | Visual |
| Resin base | Silicone | - | - |
| Filler | Non-Metal | - | - |
| Viscosity | 181 | Pa.s | ISO 3219 |
| Density | 2.7 | g/cm³ | ASTM D792 |
| Application temperature | -60~180 | °C | - |
| Bond line thickness | 30 | µm | - |
| ROHS & REACH | Compliant | - | - |
| THERMAL | |||
| Thermal conductivity | 6.0 | W/m*K | ASTM D5470 |
| Thermal impedance@50psi | 0.01 | °C-in²/ W | ASTM D5470 |
| Thermal impedance@50psi | 6.4 | °C-mm²/ W | ASTM D5470 |
Related Product
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