液態
墊片
吸波
膠帶
輕量
絕緣
石墨
斷熱
矽型 · 導熱材料 ——
/ Thermal conductivity: 3.2 W/m*K
/ Low thermal impedance
/ Can be applied manually dispensed or screen printed
/ Low minimum bond line
/ Tinplate Can: 1kg
/ Other special and custom sizes are available upon request
/ LED appliance
/ EV electric vehicle
/ CPU and chip coolers
/ Switching power supplies
/ 5G base station & infrastructure
/ Between any heat-generating component and heat sink
PROPERTY | G3380B | UNIT | TEST METHOD |
---|---|---|---|
Color | Gray | - | Visual |
Resin base | Silicone | - | - |
Filler | Non-Metal | - | - |
Viscosity | 130 | Pa.s | ISO 3219 |
Density | 2.7 | g/cm³ | ASTM D792 |
Application temperature | -60~180 | °C | - |
Bond line thickness | 33 | µm | - |
ROHS & REACH | Compliant | - | - |
THERMAL | |||
Thermal conductivity | 3.2 | W/m*K | ASTM D5470 |
Thermal impedance@50psi | 0.03 | °C-in²/ W | ASTM D5470 |
Thermal impedance@50psi | 19.3 | °C-mm²/ W | ASTM D5470 |