RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
G3380A
1.3 W/m·K
Low minimum bond line
G3380A 系列導熱膏具有極低熱阻和良好的導熱性,已廣泛用於消費電子產品和微處理器的熱控制技術,當組件的溫度升高,潤滑脂的黏性會降低,可以潤濕界面元件,熱傳導係數:1.3 W/m*K的間隙填充材料。

CATEGORY

FEATURES

/ Thermal conductivity: 1.3 W/m*K
/ Low thermal impedance
/ Can be applied manually dispensed or screen printed
/ Low minimum bond line

CONFIGURATIONS

/ Tinplate Can: 1kg
/ Other special and custom sizes are available upon request

TYPICAL APPLICATION

/ LED appliance
/ EV electric vehicle
/ CPU and chip coolers
/ Switching power supplies
/ 5G base station & infrastructure
/ Between any heat-generating component and heat sink

TYPICAL PROPERTIES

PROPERTY G3380A UNIT TEST METHOD
Color White - Visual
Resin base Silicone - -
Filler Non-Metal - -
Viscosity 16.5 Pa.s ISO 3219
Density 2.2 g/cm³ ASTM D792
Application temperature -60~180 °C -
Bond line thickness 55 µm -
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 1.3 W/m*K ASTM D5470
Thermal impedance@50psi 0.05 °C-in²/ W ASTM D5470
Thermal impedance@50psi 32.2 °C-mm²/ W ASTM D5470

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