RBA
ROHS
REACH
UL
IATF 16949
ISO 14001
ISO 9001
ISO/TS 16949
IECQ 080000
EP770-s電子灌封膠是保護電子元件與電路板的重要材料,透過將液態膠體澆灌並固化於電子組件之間,可填滿電子器件周圍空氣空間的縫隙,形成長期且有效的防護層,可達到防水、防潮、耐震、電氣絕緣和保護關鍵線束等多重效果。EP770-s無低分子矽氧烷揮發,不會造成電器接點故障,適合光學產品或敏感的電子原件使用。
TPS32
1.5 W/m*K
電源保護灌封膠 TPS32 是一款輕量化的灌封膠。可為產品提高其性能及減少能源消耗,常被應用在航空航太及汽車電子設備上。導熱係數1.50 W/m*K,,可填滿電子裝置周圍空氣空間的縫隙,固化後與發熱的電子元件和散熱器保持密切接觸,使電子產品能夠在高功率下運作進行熱傳導。能顯著提升產品的可靠度、使用壽命,並降低外界環境帶來的損害風險。

CATEGORY

Thermal Putty

FEATURES

/ Lightweight, Low Density, Thermal Conductivity 1.5 W/m*K
/ Medium-to-high hardness silicone material with excellent insulation and weather resistance
/ Suitable for automatic dispensing machine
/ TPS32 Hardened at room temperature, also can be heated to accelerate the hardening reaction.

/// It can be preserved for 60 months under the condition of unopened and under room temperature 25°C.

PRECAUTIONS

/ TPS32 If the interface has organic compounds such as Nitrogen, Phosphorous, Sulfur etc., and heavy
metals ionic compound such as Tin, Lead, Mercury, Antimony, Bismuth, Arsenic etc., and
Organometallic-salts etc., which will cause the gel incomplete curving even will be non-curved.

TYPICAL APPLICATION

/ Heat Dissipation & lightweight applications, such as Automotive electronic devices, Mobile communication device, Drone & aircraft, Sports and leisure electronic products, Portable game consoles, VR devices and etc.
/ 5G base station & infrastructure
/ EV electric vehicle

TYPICAL PROPERTIES

PROPERTY TPS32 TEST METHOD UNIT
Color White(A) / Black(B) Visual -
Resin Base Silicone - -
Viscosity 3.2 ISO 3219 Pa.s
Density 1.72 ASTM D792 g/cm³
Application temperature -60~180 - °C
Working Time 25°C/1 hr By LiPOLY -
Hardness 65 ASTM D2240 Shore A
ROHS & REACH Compliant - -
THERMAL
Thermal conductivity 1.5 ASTM D5470 W/m*K
Dielectric breakdown 9 ASTM D149 KV/mm
Volume resistivity >10¹³ ASTM D257 Ohm-m

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